Premium grade industrial copper alloys engineered for high conductivity, durability, and extreme thermal environments.
An in-depth look at how pseudo-alloys solve thermal expansion mismatches in modern microelectronics.
Molybdenum Copper (Mo-Cu) features a adjustable Coefficient of Thermal Expansion (CTE). By varying the ratio of molybdenum to copper, we can match the CTE of key semiconductor substrates like Silicon (Si), Gallium Arsenide (GaAs), and Alumina ceramics, preventing thermal stress fractures.
Unlike traditional molybdenum metals, copper infiltration introduces a continuous phase network with exceptionally high thermal conductivity (exceeding 180-220 W/m·K depending on the composition). This ensures rapid heat dissipation in high-power semiconductor packaging.
Pure molybdenum is notoriously brittle and difficult to shape. The presence of copper ductile binder phase significantly enhances the material's overall machinability, allowing for precision EDM cutting, stamping, and complex CNC milling of heat sinks.
| Alloy Grade (Nominal Composition) | Density (g/cm³) | Thermal Conductivity (W/m·K) | Coefficient of Thermal Expansion (10⁻⁶/K) | Electrical Conductivity (% IACS) | Typical Applications |
|---|---|---|---|---|---|
| Mo-30Cu (70% Mo, 30% Cu) | 9.8 - 10.0 | 160 - 180 | 8.0 - 9.0 | 35 - 40 | High Power RF Packages, Laser Diode Mounts |
| Mo-40Cu (60% Mo, 40% Cu) | 9.5 - 9.7 | 180 - 200 | 9.5 - 10.5 | 42 - 48 | IGBT Baseplates, Automotive Electronics |
| Mo-50Cu (50% Mo, 50% Cu) | 9.2 - 9.4 | 210 - 230 | 11.5 - 12.5 | 50 - 55 | Thermal Spreaders, Switch Contacts, High Heat Flux Devices |
A leading pioneer in strategic new-energy metal alloys and advanced copper composite fabrication.
Technological innovation is the core competitiveness of Sichuan Kepai New Materials Co., Ltd. The company has a research and development and production team composed of senior industry experts who keep pace with international cutting-edge technology trends and continuously explore the unknown boundaries in the field of new copper alloy materials.
Through a combination of independent research and development and industry-university-research collaboration, Kepai has made breakthrough progress in several areas, including high-performance tellurium copper, lead copper, and sulfur copper. Many of its technological achievements have reached international advanced levels and have been successfully applied in various industries such as new energy vehicles, precision machining parts, plasma cutting, relays, and energy storage, earning widespread recognition and praise in the market.
Kepai's product line is rich and diverse, covering a comprehensive range of solutions from basic materials to high-end customization. We focus on providing customers with high-performance, high-quality high-end copper alloy products, including but not limited to pure copper, oxygen-free copper, oxygen-free high-conductivity tellurium copper, nickel tellurium copper, tin bronze, beryllium copper, lead bronze, sulfur copper, and chromium zirconium copper.
These products play an important role in reducing production costs and enhancing product performance due to their excellent physical and chemical properties and environmental friendliness, creating significant economic and social benefits for customers.
In the face of global market competition, Sichuan Kepai New Materials adheres to the development strategy of "rooted in Sichuan, radiating nationwide, and moving towards the world." By continuously optimizing market layout and improving the sales network, we have established a stable customer base in multiple provinces and cities across the country and have formed long-term cooperative relationships with several internationally renowned enterprises.
At the same time, the company actively expands into overseas markets, participates in international competition and cooperation, and strives to promote Kepai's brand influence on the global stage.
We understand that the long-term development of an enterprise is inseparable from an excellent corporate culture. We advocate the corporate spirit of "integrity, innovation, collaboration, and win-win," encouraging employees to explore boldly and innovate courageously, while also emphasizing teamwork and talent cultivation, striving to create a harmonious, open, and inclusive work atmosphere.
We believe that only by continuously pursuing excellence and creating value can we win the trust of customers and the respect of society.
Unlocking value through vertical integration, raw material density, and cost-efficient customization.
China holds the world's largest natural reserves of molybdenum. By manufacturing locally in Sichuan, Kepai leverages stable, direct upstream raw material access, cushioning our global B2B clients against the price volatility common in Western supply chains.
We deploy high-temperature liquid-phase vacuum sintering and copper-infiltration technologies. This guarantees zero micro-voids, excellent hermetic seal rates, and uniform dispersion of molybdenum and copper particles throughout the micro-structure.
By blending localized industrial efficiencies with advanced metallurgy, our factory offers customized Molybdenum Copper heat spreaders at a fraction of the cost of domestic Western suppliers, keeping your manufacturing costs lean without sacrificing performance.
How Kepai's engineering and materials drive advancements in next-generation technologies.
Base station power amplifiers demand efficient heat extraction. Mo-Cu carrier substrates match the expansion of RF chips (like GaN) perfectly, preventing micro-stress fractures under heavy signal loads.
Operating in harsh space environments requires materials that survive rapid temperature swings. Molybdenum Copper is widely selected for spaceborne radar packaging and thermal control systems.
High-power IGBT (Insulated Gate Bipolar Transistor) modules generate massive heat fluxes. Mo-Cu baseplates dissipate heat from the silicon chips to cooling systems, enhancing driving range and reliability.
Ensuring microstructural integrity and precise dimensional control for every OEM batch.
Smelting Production
laying-off
Extrusion Process
Drawing Machine
Straightening Equipment
Standardized Packaging
Eddy Current Conductance
Chemical Testing Room
Metallographic Polisher
Servo Universal Tester
LCD Electronic Tester
Digital Hardness Tester
Our commitment to raw material quality control, traceablity, and international ISO benchmarks.
Find authoritative answers regarding pseudo-alloy composition, physical limits, and OEM processing options.
Looking ahead, Sichuan Kepai New Materials Co., Ltd. will continue to uphold its original intention, with even greater enthusiasm and determination, to engage in research and application in the field of new materials, contributing to the development of the new copper alloy materials industry in China and globally. We look forward to working hand in hand with friends from all walks of life to create a brilliant future together!
Browse our verified high-durability electrical copper and precision structural alloy solutions.
Kepai
